[1]田春霞.电子封装用导电丝材料及发展[J].稀有金属，2003,27(6):782-787.
[2]HSUEH H W,HUNG F Y,LUI T S,et al.Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires[J].Microelectronics Reliability,2013,53(8):1159-1163.
[3]HSUEH H W,HUNG F Y,LUI T S,et al. Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires[J]. Microelectronics Reliability,2011,51(12):2243-2249.
[4]SRIKANTH N,MURALI S,WONG Y M, et al. Critical study of thermosonic copper ball bonding[J]. Thin Solid Films, 2004,462(9):339-345.
[5]施保球,黄乙为.电子封装用银合金线性能的研究[J].电子与封装，2020,20(4): 040201.
[6]林良,臧晓丹.封装用抗腐蚀高可靠性银合金丝[J].电子与封装,，2014,14(3):9-13.
[7]WU Y H,HUNG F Y,LUI T S, et al. Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation[J]. Microelectronics Reliability, 2019,99(8):186-196.
[8]CHEN K J,HUNG F Y,CHANG C Y.A Study of the Sulfidation Behavior on Palladium-Coated Copper Wire with a Flash-Gold Layer (PCA) after Wire Bonding[J].Electronics, 2019, 8(7): 7.
[9]LEONG G C,UDA H.Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging[J].Plos One,2014,9(1): e78705.
[10]EVESQUE M,KEDDAM M,TAKENOUTI H.The formation of self-assembling membrane of hexadecane-thiol on silver to prevent the tarnishing[J].Electrochimica Acta,2004,49(17-18): 2937-2943.
[11]鲁文晔，陈蝶依，陈步荣，等.PMTA和HDT对银防变色作用的比较[J].电镀与精饰，2015,37(12):29-32.
[12]李宝增，张柳丽，林生军，等.巯基苯基四氮唑镀银层抗变色工艺研究[J].电镀与精饰，2015,37(1):35-38.
[13]杜伟，万俐，丁毅，等.十八硫醇/乙醇体系自组装膜对银的防变色作用[J].腐蚀与防护，2012(2):120-122.
[14]DONG Z M,SUN H S,XU J,et al.Fabrication,temperature-conductance and photoconductance characteristics of the macroscopic-long Ag2S nanowire bundle[J]. Acta Phys Sin, 2011, 60(7): 5.
|
