关键词: 多芯片封装, 陶瓷封装, 热阻, 热仿真, 热阻测试

Abstract: The increasing demands for higher system integration scale，smaller size andlower cost has focalized increasing public attention on system in package（SiP）.For SiP multi-chip packaging，heat dissipationis of particular importance.Single thermal resistance cannot fully represent the thermal performance of multi-chip packaging.The paper introduces the analysis method of junction-to-case thermal resistance for ceramic multi-chip packaginganddescribes the thermal characteristics using thermal resistance matrix.The test sample assembled with thermal chips of different sizes is used to obtain thermal resistance matrix usingfinite element method and transient thermal resistance test method.

Key words: multi-chip packaging, ceramic packaging, thermal resistance, thermal simulation, thermal resistance test