中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2017, Vol. 17 ›› Issue (4): 24 -29. doi: 10.16257/j.cnki.1681-1070.2017.0048

• 微电子制造与可靠性 • 上一篇    下一篇

MEMS麦克风的失效机理及失效分析

张永强,熊小平   

  1. 楼氏电子(苏州)有限公司,江苏 苏州 215143
  • 收稿日期:2016-12-18 出版日期:2017-04-20 发布日期:2017-04-20
  • 作者简介:张永强(1980—),男,河南信阳人,硕士学历,研究方向为MEMS麦克风失效分析及专利文献研究。

The Failure Mechanism and Analysis of MEMS Microphone

ZHANG Yongqiang,XIONG Xiaoping   

  1. Knowles Suzhou Co.,Ltd.Suzhou 215143,China
  • Received:2016-12-18 Online:2017-04-20 Published:2017-04-20

摘要: MEMS麦克风是将音频信号转换成电信号的微型传感器,其工作过程涉及到声学、机械学和微电子学等学科。随着MEMS麦克风封装尺寸的不断缩小和声学性能的不断提升,以电学测试结果作为失效分析出发点的传统半导体失效分析方法越来越难以满足MEMS麦克风失效分析的需要。针对MEMS麦克风独特的封装结构和工作原理,其失效分析方法主要包括声学性能测试、机械性能测试和电学性能测试,并结合传统的半导体物理失效分析手段来找到真正的失效原因及失效机理。

关键词: MEMS麦克风, 失效分析, 失效机理

Abstract: MEMS microphone is a micro-device that converts audio signals into electrical signals,of which the operation involves acoustics,mechanics and micro-electronics.Along with ever shrinking package size and enhancing performance,traditional electrical-test-based failure analysis cannot meet new requirements.A new failure analysis method is presented in the paper,in which the MEMS microphone package structure and working principle are referenced.The new failure analysis process includes audio signal test,mechanical properties and electrical performance test.In addition,traditional semiconductor physical failure analysis method is also used to dig out the root cause and the failure mechanism.

Key words: MEMS microphone, failure analysis, failure mechanism

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