中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (12): 120102 . doi: 10.16257/j.cnki.1681-1070.2021.1209

所属专题: 集成电路测试与可靠性

• “集成电路测试与可靠性”专题 • 上一篇    下一篇

气体传感器模块的失效分析及解决对策*

王彬;孙运涛;司耸涛   

  1. 中科芯集成电路有限公司,江苏 无锡 214072
  • 收稿日期:2021-05-25 出版日期:2021-12-28 发布日期:2021-07-13
  • 作者简介:王彬(1982—),男,吉林省吉林市人,硕士,高级工程师,主要从事集成电路验证、应用、可靠性、失效分析研究。

Failure Analysis and Solution of Gas SensorModule

WANG Bin, SUN Yuntao, SI Songtao   

  1. China Key System &Integrated Circuit Co., Ltd., Wuxi 214072, China
  • Received:2021-05-25 Online:2021-12-28 Published:2021-07-13

摘要: 某气体传感器模块采用CKS32F030F4P6作为主控芯片,模块在生产中出现故障,不良率为50%,故障表现为在开启激光管的过程中传感器模块出现死机现象,无法继续执行指令。经分析是激光管开启过程中的电流过大,造成CKS32F030F4P6内部的电源模块输出电压过大,超出内部工作区域的正常工作电压。Flash读写操作时发生错误,最终导致系统进入HardFault。针对该问题,分别从硬件和软件方面给出了解决方案,有效解决了产品失效问题。

关键词: 气体传感器, 失效分析

Abstract: The gas sensor module uses CKS32F030F4P6 as the main control chip. The module fails during production, with a defective rate of 50%. The failure phenomenon is that the sensor module crashes during turning on the laser tube and can't continue to execute instructions. It is analyzed that the current is too large during the laser tube's turn-on process, causing the output voltage of the power module inside the CKS32F030F4P6 to be too large, and the output voltage exceeds the normal working voltage of the internal working area. An error occurred during flash read and write operations, eventually causing the system to enter HardFault. The solutions are given from the aspects of hardware and software, which can effectively solve the problem of product failure.

Key words: gassensor, failureanalysis

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