关键词: 小外形封装, 热阻, 热设计, 仿真

Abstract: In this paper, the thermal transmission mechanism of a typical small outline package and the theoretical calculation method of thermal resistance for the equivalent heat flow channel were introduced, and the models of the same small outline package with different thermal design structures were established and the correspondence thermal resistance values are calculated by thermal simulation software. In order to validate the simulation results, the thermal resistances were tested. The results show that, for the package with main thermal transmission channel, the heat dissipation can be improved effectively by optimizing the channel structure, such as increasing the area of heat dissipation channels, shortening the thermal transfer path, exposing the paddle, expanding the number of heat transmission channels and other methods.

Key words: small outline package, thermal resistance, thermal design, simulation