中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2018, Vol. 18 ›› Issue (12): 37 -40. doi: 10.16257/j.cnki.1681-1070.2018.0135

• 微电子制造与可靠性 • 上一篇    下一篇

一种高速互连通道的信号完整性仿真研究

滕丽   

  1. 中国电子科技集团公司第二十四研究所,重庆 400060
  • 收稿日期:2018-03-04 出版日期:2018-12-20 发布日期:2018-12-20
  • 作者简介:滕丽(1978—),女,重庆市人,工学学士,主要从事集成电路测试技术研究。

A Study on SI Simulation of High-speed Interconnection Channel

TENG Li   

  1. China Electronics Technology Group Corporation No.24 Research Institute,Chongqing 400060,China
  • Received:2018-03-04 Online:2018-12-20 Published:2018-12-20

摘要: 对高速互连通道的信号完整性问题进行了研究,着重以数字激励源与D/A转换器评估板互连通道为例,分别对组成高速互连通道的微带线、过孔进行了建模分析。同时创建了整个高速互连通道的仿真模型,对高速互连通道的时域响应进行仿真,生成数据眼图,通过数据眼图评估传输通道的信号质量。

关键词: 信号完整性, 高速互连通道, 微带线, 过孔, 眼图

Abstract: In this paper,signal integrity(SI)of high-speed interconnection channel is researched.And the SI of the interconnection channel between the digital stimulus source and D/A converter is especially discussed for instance.Here,the analysis models of the microstrip line and via of high-speed interconnection channel are established.The simulation model of the whole high-speed interconnection channel is achieved and performed;the time-domain response of the high-speed interconnection channel is analyzed,and the quality of signal transmission channel is evaluated by the generated eye diagram.

Key words: signal integrity, high-speed interconnection channel, microstrip line, via, eye diagram

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