中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2022, Vol. 22 ›› Issue (11): 110204 . doi: 10.16257/j.cnki.1681-1070.2022.1114

• 封装、组装与测试 • 上一篇    下一篇

封装设计中传输线损耗的理论计算

周立彦;汤文学;庞影影;王剑峰;王波   

  1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214035
  • 收稿日期:2022-02-25 出版日期:2022-11-29 发布日期:2022-05-26
  • 作者简介:周立彦(1991—),男,江苏张家港人,博士,工[林志茂48] 程师,现从事先进封装工艺开发及设计仿真工作。

Theoretical Calculation of Transmission Line Loss in Package Design

ZHOU Liyan, TANG Wenxue, PANG Yingying, WANG Jianfeng, WANG Bo   

  1. ChinaElectronic Technology Group Corporation No.58 Research Institute, Wuxi214035, China
  • Received:2022-02-25 Online:2022-11-29 Published:2022-05-26

摘要: 针对高速信号设计中反射引起的信号完整性问题,推导了单一网络中散射参数关于阻抗分布的数学表达式,明确了传输结构中阻抗失配程度与分布长度对回波损耗的影响。基于该表达式,进一步阐述了时域、频域中反射计算的差异性。结合常见的频域现象和仿真预测,解释了回波损耗高频恶化、回波损耗不对称的原因,提出了适用于特定频率范围的反常规阻抗匹配设计思路,为初涉信号完整性设计领域的人员深入浅出地理解阻抗匹配提供了参考。

关键词: 信号完整性, 阻抗失配, 散射参数, 时域, 仿真

Abstract: For the signal integrity problems caused by reflection in high speed signal design, the mathematical expression of scattering parameters on impedance distribution in a single network is derived, and the influence of impedance mismatch degree and distribution length on return loss in transmission structure is clarified. Based on this expression, the difference of reflection calculation between frequency domain and time domain is further discussed. Combining common frequency domain phenomena and simulation predictions, it explains the causes of high frequency deterioration of return loss and asymmetric return loss, and proposes some unconventional methods for impedance design in specific frequency range, thus providing an in-depth understanding of impedance matching for those who are new to the field of signal integrity design.

Key words: signal integrity, impedance mismatch, scattering parameter, time domain, simulation

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