超声功率对25 μm铂金丝球形键合强度的影响及键合点质量评价

doi:10.16257/j.cnki.1681-1070.2019.1102

电子与封装 ›› 2019, Vol. 19 ›› Issue (11): 4 -5. doi: 10.16257/j.cnki.1681-1070.2019.1102

超声功率对25 μm铂金丝球形键合强度的影响及键合点质量评价

赵振力^1,2, 孙闻^1,2

1.中国科学院上海技术物理研究所传感技术国家重点实验室,上海 200083;
2.中国科学院红外成像材料与器件重点实验室,上海 200083

出版日期:2019-11-20 发布日期:2019-12-25
作者简介:赵振力(1994—),男,甘肃会宁人,2016年毕业于上海电力学院(现上海电力大学)能源与机械工程系,现从事电子元器件封装研究工作。

Effect of Ultrasound Power on the Strength of 25 μm Platinum Wire Spherical Bonding Process and Quality Evaluation of Bonding Point

ZHAO Zhenli^1,2, SUN Wen^1,2

1. State Key Laboratory of Transducer Technology, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China;
2. Key Laboratory of Infrared Imaging Materials and Devices, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China

Online:2019-11-20 Published:2019-12-25

摘要/Abstract

摘要： 铂金丝作为低温器件封装中理想的键合丝,其键合质量的优劣决定着整个器件的性能和可靠性。通过25 μm的铂金丝球形键合试验,并使用OLYMPUS SMT-6三轴测量显微镜观察键合点形貌并测量第一键合点根部直径。结果表明,当超声功率介于0.96~1.2 W时,增加超声功率有助于提高键合强度,增加工艺稳定性。在文中所设实验条件下,为保证键合强度和工艺稳定性,超声功率设置为1.2~1.28 W时最佳。第一焊点键合球平均直径为2.8 W_D(W_D表示键合线直径)时,键合强度最大,工艺稳定性最好。总结出了键合点直径与拉力值关系图,从而通过键合点直径来评价键合质量。

关键词: 超声功率, 铂金丝, 球形键合, 质量评价

Abstract: As an ideal bonding wire in cryogenic device packaging, the bonding quality of platinum wire determines the performance and reliability of the whole device. The spherical bonding experiment of platinum wire at 25 μm was carried out. The morphology of bonding point and the diameter of the first bonding point were observed by OLYMPUS SMT-6 triaxial measuring microscope. The results show that when the ultrasonic power increases from 0.96 W to 1.2 W, the increase of ultrasonic power is helpful to improve bonding strength and process stability. Under the experimental conditions set in this paper, in order to ensure bonding strength and process stability, the optimal ultrasonic power is set from 1.2 W to 1.28 W. When the average diameter of the first bonding point is 2.8 times W_D, the bonding strength is the largest and the process stability is the best. The relation diagram between bonding point diameter and pull force was summarized, and bond quality was evaluated by bonding point diameter.

Key words: ultrasound power, platinum wire, spherical bonding, quality evaluation

中图分类号:

赵振力, 孙闻. 超声功率对25 μm铂金丝球形键合强度的影响及键合点质量评价[J]. 电子与封装, 2019, 19(11): 4 -5.

ZHAO Zhenli, SUN Wen. Effect of Ultrasound Power on the Strength of 25 μm Platinum Wire Spherical Bonding Process and Quality Evaluation of Bonding Point[J]. Electronics & Packaging, 2019, 19(11): 4 -5.

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

超声功率对25 μm铂金丝球形键合强度的影响及键合点质量评价

Effect of Ultrasound Power on the Strength of 25 μm Platinum Wire Spherical Bonding Process and Quality Evaluation of Bonding Point

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