中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

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电子与封装 ›› 2019, Vol. 19 ›› Issue (2): 045 -48. doi: 10.16257/j.cnki.1681-1070.2019.0023

• 产品、应用与市场 • 上一篇    

半导体生产企业设备备件管理探讨

薛文卿,胡 超,尤 春   

  1. 无锡中微掩模电子有限公司,江苏 无锡 214135
  • 收稿日期:2018-04-02 出版日期:2019-02-20 发布日期:2019-02-20
  • 作者简介:薛文卿(1967—),男,江苏常州人,本科学历,从事掩模工艺技术研究。

Discussion on Equipment Spare Parts Management in Semiconductor Manufacturing

XUE Wenqing, HU Chao, YOU Chun   

  1. Wuxi Zhongwei Mask Electronics Co., Ltd., Wuxi 214135, China
  • Received:2018-04-02 Online:2019-02-20 Published:2019-02-20

摘要: 浅析半导体生产企业备品备件管理的目的性和内容,介绍备品备件的分类及重要备件缺乏时的应急措施等内容。以半导体行业中设备备件管理作为研究对象,对业内备品备件管理模式进行了探讨,并据此提出合理化建议。

关键词: 半导体生产企业, 备品备件, PM易耗件, 应急措施, 管理模式

Abstract: This paper analyzes the purpose and content of the spare parts management of semiconductor manufacturing enterprises, and introduces the classification of spare parts and the emergency solution for the lack of important spare parts. This paper takes the management of equipment spare parts in the semiconductor industry as the object of study, analyzes the advantages and disadvantages of the spare parts management in the industry, and puts forward the rationalization proposals accordingly.

Key words: semiconductor manufacturing enterprises, spare parts, PM consumable parts, emergency measure, management model

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