关键词: 等离子清洗, 直流电流等离子, 射频等离子, 微波等离子

Abstract: Plasma cleaning is more and more important in semiconductor package, and plasmas excited by different mechanisms are different.By analyzing exciting mechanisms, plasma clean effects and characterizations of direct current plasma, radio frequency plasma and microwave plasma are studied and analyzed.By comparing the influences on different package processes,the proper plasma type matching with under-fill,wire bond and molding is proved.The results are helpful to understand plasma clean and select proper plasma type for package process.

Key words: plasma cleaning, direct current plasma, radio frequency plasma, microwave plasma