关键词: 表贴器件, X 射线检测, PCBA, 焊接缺陷

Abstract: With the extensive application of surface mounted devices such as BGA and CPS packaging,traditional inspection techniques such as artificial vision inspection and automatic optical inspection can hardly detect the welding quality of the bottom lead-in end.X-ray detection method and detection process are studied and given, and the typical cases of this method applied to PCBA welding quality detection are analyzed.According to this method, not only common welding defects in PCBA can be identified efficiently and conveniently,but also PCB design and welding process improvement can be guided.

Key words: surface mounted devices, X-ray detection, PCBA, welding defects