中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (1): 010201 . doi: 10.16257/j.cnki.1681-1070.2021.0102

• 封装、组装与测试 • 上一篇    下一篇

FPGA潜在缺陷测试技术综述

黄姣英,李鹏,高成   

  1. 北京航空航天大学可靠性与系统工程学院,北京 100191
  • 收稿日期:2020-07-03 出版日期:2021-01-20 发布日期:2020-08-22
  • 作者简介:黄姣英(1978—),女,博士,湖南张家界人,高级工程师,研究方向为电子元器件可靠性试验、分析与评价。

LiteratureReview of FPGA Potential Defect Testing Technology

HUANG Jiaoying, LI Peng, GAO Cheng   

  1. School ofReliability and Systems Engineering, BeihangUniversity, Beijing 100191, China
  • Received:2020-07-03 Online:2021-01-20 Published:2020-08-22

摘要: 在FPGA的设计、生产过程中,测试是保证器件质量的关键步骤。针对FPGA典型的潜在缺陷,阐述了主流的FPGA测试方法,对各方法的优缺点做了简要对比和总结。同时提出了对构成FPGA的可编程逻辑资源、互联线资源、端口资源、内嵌核四大模块分别进行测试的分类测试法,分析每个模块的典型缺陷,归纳对应的测试方法。

关键词: 逻辑资源, 互联线资源, 端口资源, 内嵌核, 测试方法

Abstract: In the process of FPGA designing and producing, testing is a key step to ensure components’ quality. Aiming at the typical potential defects of FPGA, the main FPGA test methods are described, and the advantages and disadvantages of each method are briefly compared and summarized. At the same time, a classification test method for testing the four major modules that constitute the configurable logic block, interconnection resource, input and output resources, and embedded core of the FPGA is proposed respectively. The typical defects of each module are analyzed, and the corresponding test methods are summarized.

Key words: logicresources, interconnectlineresources, inputandoutputresources, embeddedcore, testmethod

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