关键词: 陶瓷封装, 等效热模型, 仿真

Abstract: The model of ceramic package device and testing Printed Circuit Board (PCB) has been equivalently calculated by using the theory of equivalent heat model in this article. The thermal resistance has been simulated by the Icepak which is a software of thermal analysis. Temperature distribution of the ceramic package device has been tested and calculated by the T3ster machine which is a thermal resistance tester. The results show that the thermal resistance calculated by using the method of equivalent thermal model has a good consistency with the testing value. It indicates there is a feasibility of the thermal equivalent method to calculate the thermal resistance.

Key words: ceramicpackage, equivalentthermalmodel, simulation