关键词: 引线键合, 焊盘裂纹, 焊盘结构

Abstract: Wire bonding is one of the key processes in packaging. By bonding the first solder joint with the chip pad, bonding the second solder joint with the substrate and forming a wire arc, the circuit is connected to achieve the function of the product. In the process of bonding the first solder joint to the chip pad, the pad is subjected to a certain bonding stress, and excessive stress is likely to cause pad cracks and result in product failure. Therefore, the bonding strength of the first solder joint and the setting of wire bonding parameters are particularly important. By optimizing the structures of pads, wire bonding parameters and bonding operation modes, the risk of pad cracking can be reduced. This method provides a reference for avoiding the occurrence of pad cracks in pads with different materials and structures.

Key words: wire bonding, pad cracks, structures of pads