关键词: 2.5D封装, 多热源, 多芯片封装热阻, 结构函数, 热阻矩阵

Abstract: In 2.5D multi-chip high-density packaging, the complex heat flow boundaries of multiple heat sources and the thermal coupling of adjacent heat sources are enhanced, the high precision thermal resistance test and simulation verificationare key to the thermal design of the package. A thermal test verification chip (TTC) based on a 100-micron heat simulation unit is designed and developed. Based on a multi-spot power driven circuit system and a multi-channel high-speed acquisition temperature mapping system, the equivalent simulation of the actual thermal generation of the 2.5D multi-chip package and the multi-point in situ monitoring of the chip temperature are realized. The actual thermal test structure function is imported into thermal simulation software to achieve the parameter fitting and calibration of simulation model. The thermal coupling superposition effect of multi-chip package is calculated by thermal resistance matrix method, and the equivalent thermal resistance of multi-heat source package is achieved The results show that the self-thermal resistance and coupling thermal resistance of multi-chip package increase with the increase of chip power density, and the influence of hot spot distribution on the package thermal resistance is more significant. Therefore, simulating the heat state of the actual chip and establishing the equivalent thermal simulation model are key to achieve high precision package thermal simulation and heat dissipation structure design.

Key words: 2.5D package, multi-heat sources, thermal resistance of multi-chip package, structure function, thermal resistance matrix