关键词: DFN封装, 翘曲, 田口法优化, 有限元仿真

Abstract: With the continuous development of electronic technology, chips are increasingly developing towards system-level package, and the package industry has ushered in new challenges and opportunities. Package can provide mechanical support, electrical connection and heat dissipation for the chip, so its reliability research has attracted much attention. Dual flat no-lead (DFN) package is a leadless surface mount package technology. Unreasonable material combination or structural design can lead to warping or stress concentration, which directly affects the coplanarity and reliability of the package, causing problems such as chip fracture and solder delamination. For typical DFN package structures, the warpage and stress of key parts of specific package products after reflow soldering and under thermal cycling loads are studied by finite element simulation. The DFN package design parameters are evaluated and optimized by Taguchi method to obtain the optimal combination of structural parameters. The optimal structural parameter combinations are compared with the actual product simulation results, the rationality of the simulation model is verified, and the theoretical guidance is provided for the actual production of high-reliability DFN package.

Key words: DFN package, warpage, Taguchi method optimization, finite element simulation