中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2024, Vol. 24 ›› Issue (4): 040205 . doi: 10.16257/j.cnki.1681-1070.2024.0042

• 封装、组装与测试 • 上一篇    下一篇

基于压力辅助烧结方法改善LTCC基板翘曲的研究

杨兴宇,马其琪,张艳辉,贾少雄   

  1. 中国电子科技集团公司第二研究所,太原 ?030024
  • 收稿日期:2023-06-01 出版日期:2024-04-24 发布日期:2024-04-24
  • 作者简介:杨兴宇(1992—),男,山西原平人,硕士,工程师,主要从事多层陶瓷基板工艺的研发工作。

Research on Improving Warpage of LTCC Substrates Based on Pressure-Assisted Sintering Method

YANG Xingyu, MA Qiqi, ZHANG Yanhui, JIA Shaoxiong   

  1. China Electronics Technology GroupCorporation No.2 Research Institute, Taiyuan 030024, China
  • Received:2023-06-01 Online:2024-04-24 Published:2024-04-24

摘要: 低温共烧陶瓷(LTCC)基板普遍存在翘曲问题。由于不同材料和结构的LTCC基板的翘曲存在差异性,基于基板材料和结构方面改善翘曲的办法存在一定的局限性。提出一种新型的压力辅助烧结方法,该方法通过将耐高温压片和LTCC基板相结合,能够有效改善基板翘曲,同时满足基板的可靠性要求。不同厚度的耐高温压片能够平衡基板翘曲和扭曲之间的关系,从而确保LTCC基板形态稳定。压力辅助烧结方法为改善LTCC基板翘曲提供了新的思路。

关键词: 封装技术, LTCC基板, 翘曲, 扭曲, 压力辅助烧结

Abstract: Low temperature co-fired ceramic (LTCC) substrates commonly suffer from warpage problems. Due to the variability in warpage of LTCC substrates with different materials and structures, there are limitations in the approaches to improving warpage based on substrate material and structure. A novel pressure-assisted sintering method is proposed, which combines high-temperature resistant platen and LTCC substrate to effectively improve substrate warpage while meeting the reliability requirements of the substrate. High-temperature resistant platens with different thicknesses can balance the relationship between warpage and distortion, thus ensuring stable LTCC substrate morphology. The pressure-assisted sintering method provides a new idea to improve LTCC substrate warpage.

Key words: packaging technology, LTCC substrate, warpage, distortion, pressure-assisted sintering

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