关键词: 有机基板, 互联凸点, 有限元分析, 开路失效

Abstract: In order to meet the demands for product portability and multifunctionality, chip design is developing towards the trend of multifunctionality and large-scale integration, and integrated circuit packaging is gradually evolving towards large size and high density. In particular, the application of flip chip technology can achieve higher packaging density and faster signal transmission speed. However, there are differences in the coefficients of thermal expansion of different materials, and thermal mismatch can easily lead to open-circuit failure of interconnection bumps. In order to study the reasons for the failure of flip chip of the organic substrate for integrated circuit in the packaging process, scanning electron microscopy (SEM) combined with finite element analysis is used to simulate and analyze the stress distribution state of the organic substrate in the temperature cycling and reflow soldering process, and the results show that the bumps around the edges of the organic substrate are subjected to a higher level of stress during reflow soldering process. The use of magnetic carriers and the prefabricated solder on pads can significantly reduce the risk of circuit failure.

Key words: organic substrate, interconnection bump, finite element analysis, open-circuit failure