液体环氧塑封料的应用进展*

doi:10.16257/j.cnki.1681-1070.2025.0118

电子与封装 ›› 2025, Vol. 25 ›› Issue (10): 100205 . doi: 10.16257/j.cnki.1681-1070.2025.0118

液体环氧塑封料的应用进展^*

肖思成¹，李端怡¹，任茜¹，王振中¹，刘金刚^1,2

1. 中国地质大学北京材料科学与工程学院地质碳储与资源低碳利用教育部工程研究中心，北京 100083；2. 笛斯安新材料研发三河有限公司，河北廊坊 065200

收稿日期:2025-03-12 出版日期:2025-10-29 发布日期:2025-04-11
作者简介:肖思成（2003—），男，湖北襄阳人，硕士研究生，主要研究方向为耐高温电子封装材料。

Progress on the Application of Liquid Epoxy Molding Compounds

XIAO Sicheng¹, LI Duanyi¹, REN Xi¹, WANG Zhenzhong¹, LIU Jin'gang^1,2

1.Engineering Research Center of Ministry of Education for Geological CarbonStorage and Low Carbon Utilization of Resources, School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China; 2.Disan New Materials Research & DevelopmentSanheCo., Ltd., Langfang 065200, China

Received:2025-03-12 Online:2025-10-29 Published:2025-04-11

摘要/Abstract

摘要： 系统梳理并总结了液体环氧塑封料（LEMC）的应用领域及实际应用情况。从集成电路先进封装技术的发展对LEMC的性能需求、LEMC的组成与结构设计、LEMC的研究与开发等角度阐述了LEMC在扇出型晶圆级封装（FOWLP）以及高带宽存储器（HBM）中的应用进展。

关键词: 液体环氧塑封料, 集成电路封装, 高带宽存储器, 回流成型底部填充（MR-MUF）

Abstract: The application fields and practical application situations of liquid epoxy molding compounds (LEMCs) are systematically sorted out and summarized. The application progress of LEMCs in fan-out wafer-level packaging (FOWLP) and high bandwidth memory (HBM) is discussed from the property requirements of the development of integrated circuit advanced packaging technologies to LEMCs, the structural design and composition of LEMCs, and the research and development of LEMCs.

Key words: liquid epoxy molding compound, integrated circuit packaging, high bandwidth memory, mass reflow-molded underfill (MR-MUF)

中图分类号:

肖思成，李端怡，任茜，王振中，刘金刚. 液体环氧塑封料的应用进展^*[J]. 电子与封装, 2025, 25(10): 100205 .

XIAO Sicheng, LI Duanyi, REN Xi, WANG Zhenzhong, LIU Jin'gang. Progress on the Application of Liquid Epoxy Molding Compounds[J]. Electronics & Packaging, 2025, 25(10): 100205 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

液体环氧塑封料的应用进展^*

Progress on the Application of Liquid Epoxy Molding Compounds

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