Sn-Pb铜核微焊点液-固界面反应及力学性能研究*

doi:10.16257/j.cnki.1681-1070.2025.0119

摘要/Abstract

摘要： Cu核微焊点相比传统Sn基微焊点具有更好的导电、导热及力学性能，且可有效控制焊点高度。探究了Sn-Pb合金电沉积工艺，电镀制备出Cu@Sn-Pb、Cu@Ni@Sn-Pb 2种Cu核微焊球，进一步研究了微焊点在250 ℃下回流的液-固界面反应，并探究了微焊点的剪切断裂机理。结果表明，Sn-Pb镀层成分受Pb²⁺浓度、络合剂质量浓度、电流密度以及镀液温度等因素影响。镀液温度为25 ℃、电流密度为1~2 A/dm²时电镀效果最佳。回流后，Cu/Cu@Sn-Pb/Cu微焊点中Sn-Pb/Cu核及Sn-Pb/Cu基板界面处均形成厚度相近的扇贝状Cu₆Sn₅及薄层状Cu₃Sn界面金属间化合物（IMC）；而Cu/Cu@Ni@Sn-Pb/Cu微焊点中Sn-Pb/Ni/Cu核及Sn-Pb/Cu基板界面上均形成扇贝状(Cu,Ni)₆Sn₅ IMC，由于Cu-Ni的交互作用，Cu₃Sn IMC生长受到抑制，且Cu基板侧IMC层厚度明显大于Cu核侧。剪切测试结果表明，回流1 min时，Cu/Cu@Ni@Sn-Pb/Cu微焊点与Cu/Cu@Sn-Pb/Cu微焊点剪切强度分别为55.2 MPa和47.9 MPa，镀Ni层后焊点强度提高15.2%。

关键词: 电子封装, Sn-Pb钎料, Cu核微焊点, 液-固界面反应, 金属间化合物

Abstract: Cu-cored micro-solder joints exhibit superior electrical conductivity, thermal conductivity, and mechanical properties compared to traditional Sn-based micro-solder joints, enabling effective control over solder joint height. The electrodeposition process of Sn-Pb alloys is investigated, and two types of Cu-cored micro-solder balls (Cu@Sn-Pb and Cu@Ni@Sn-Pb) are fabricated through electroplating. The liquid-solid interfacial reactions of micro-solder joints are investigated during reflow at 250 ℃ and the shear fracture mechanism is explored. The results indicate that the composition of the Sn-Pb coating is influenced by Pb²⁺concentration, chelating agent mass concentration, current density, and electroplating solution temperature. The optimal electroplating results are achieved with the electroplating solution temperature at 25 ℃ and the current density of 1-2 A/dm². After reflow, Cu/Cu@Sn-Pb/Cu micro-solder joints form scallop Cu₆Sn₅ and thin laminar Cu₃Sn intermetallic compounds (IMCs) on both sides of the Sn-Pb/Cu-core and Sn-Pb/Cu-substrate interface. The Cu/Cu@Ni@Sn-Pb/Cu micro-solder joints form scallop-shaped (Cu,Ni)₆Sn₅ IMCs on the Sn-Pb/Ni/Cu-core side and Sn-Pb/Cu-substrate interface. Due to Cu-Ni interactions, the growth of Cu₃Sn IMCs is suppressed, and the IMC layer thickness on the Cu substrate side is significantly greater than that on the Cu core side. Shear test results indicate that the shear strengths of Cu/Cu@Ni@Sn-Pb/Cu micro-solder joints and Cu/Cu@Sn-Pb/Cu micro-solder joints are respectively 55.2 MPa and 47.9 MPa, and the micro-solder joint strength is increased by 15.2% after Ni plating.

Key words: electronic packaging, Sn-Pb solder, Cu-cored micro-solder joints, liquid-solid interfacial reaction, intermetallic compound

中图分类号:

丁钰罡，陈湜，乔媛媛，赵宁. Sn-Pb铜核微焊点液-固界面反应及力学性能研究^*[J]. 电子与封装, 2025, 25(10): 100206 .

DIING Yugang, CHEN Shi, QIAO Yuanyuan, ZHAO Ning. Study on Liquid-Solid Interfacial Reactions and Mechanical Property of Sn-Pb Cu-Cored Micro-Solder Joints[J]. Electronics & Packaging, 2025, 25(10): 100206 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

Sn-Pb铜核微焊点液-固界面反应及力学性能研究^*

Study on Liquid-Solid Interfacial Reactions and Mechanical Property of Sn-Pb Cu-Cored Micro-Solder Joints

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