中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2025, Vol. 25 ›› Issue (12): 120402 . doi: 10.16257/j.cnki.1681-1070.2025.0152

• 材料、器件与工艺 • 上一篇    下一篇

真空加热炉温度均匀性提升研究*

徐星宇1,李早阳1,史睿菁1,王成君2,王君岚1,罗金平1,金雨琦1,朱帆1,张辉3   

  1. 1. 西安交通大学能源与动力工程学院,西安  710049;2. 中国电子科技集团公司第二研究所,太原  030024;3. 东南大学机械工程学院,南京  211189
  • 收稿日期:2025-04-09 出版日期:2025-12-26 发布日期:2025-06-05
  • 作者简介:徐星宇(2000—),男,江苏连云港人,硕士,主要研究方向为晶圆键合装备优化设计。

Improvement Study of Temperature Uniformity in Vacuum Heating Furnace

XU Xingyu1, LI Zaoyang1, SHI Ruijing1, WANG Chengjun2, WANG Junlan1, LUO Jinping1, JIN Yuqi1, ZHU Fan1, ZHANG Hui3   

  1. 1. School of Energy and PowerEngineering, Xi’an JiaotongUniversity, Xi’an 710049, China; 2. China ElectronicsTechnology Group Corporation No.2 ResearchInstitute, Taiyuan 030024, China; 3. School of MechanicalEngineering, Southeast University, Nanjing 211189, China
  • Received:2025-04-09 Online:2025-12-26 Published:2025-06-05

摘要: 针对电子器件热处理中常用的晶圆键合台真空加热炉建立三维仿真模型,研究炉体内部的热量传递与温度分布规律。在此基础上评估加热炉的温度均匀性,并提出保温环结构与高导热材料设计方案。研究结果表明,加热炉加热面温度分布不均主要由加热丝的非中心对称布置和加热面边缘漏热导致,在加热面边缘布置保温环或加热盘材料使用碳化硅陶瓷时,面温度非均匀性由3.2%分别优化至2.5%和1.7%,这为晶圆键合台真空加热炉温度均匀性的提升起到积极推动作用。

关键词: 温度均匀性, 真空加热炉, 保温环结构, 高导热材料

Abstract: A three-dimensional simulation model is established for the wafer bonding vacuum heating furnace commonly used in the heat treatment of electronic devices to study the heat transfer and temperature distribution inside the furnace. Based on this, the heating furnace's temperature uniformity is evaluated, and design solutions for the thermal insulation ring structure and high-thermal-conductivity materials are proposed. The results show that the uneven temperature distribution on the heating surface is mainly caused by the non-centrosymmetric arrangement of the heating wires and heat leakage at the edges. When a thermal insulation ring is installed at the edge of the heating surface, or when silicon carbide ceramic is used as the heating plate material, the surface temperature non-uniformity is reduced from 3.2% to 2.5% and 1.7%, respectively. This work contributes positively to improving the temperature uniformity of the wafer bonding vacuum heating furnace.

Key words: temperature uniformity, vacuum heating furnace, insulation ring structure, high thermal conductivity material

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