中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2017, Vol. 17 ›› Issue (3): 5 -9. doi: 10.16257/j.cnki.1681-1070.2017.0028

• 封装、组装与测试 • 上一篇    下一篇

带通滤波器LTCC工艺优化研究

张伟,秦超,贾少雄   

  1. 中国电子科技集团公司第二研究所,太原 030024
  • 收稿日期:2016-11-28 出版日期:2017-03-20 发布日期:2017-03-20
  • 作者简介:张 伟(1986—),男,山西忻州人,工学硕士,现从事LTCC工艺及微波元器件研发工作。

Study on LTCC Process Optim ization of Band-pass Filter

ZHANG Wei,QIN Chao,JIA Shaoxiong   

  1. China Electronics Technology Group Corporation No.2 Research Institute,Taiyuan 030024,China
  • Received:2016-11-28 Online:2017-03-20 Published:2017-03-20

摘要: 针对LTCC(低温共烧陶瓷技术) 带通滤波器结构以及制作工艺特点,对LTCC带通滤波器制作的过程工序进行试验及分析,确定了制作偏差超过设计容差的过程工序。以滤波器设计容差为参考依据分别对相关工序以及偏差量进行了详细分析,提出了针对性工艺优化措施,有效解决了滤波器中心频率偏移的问题。采用优化后工艺所制作的滤波器中心频率偏差由±30 MHz提高到±5 MHz,满足使用要求。

关键词: LTCC, 过程工序, 工艺优化

Abstract: LTCC(Low Temperature Co-fire Ceramic)band-pass filter structure and process characteristics, togetherw ith testing and analysis during the process helps locate the process causing the deviation over the design tolerance.Based on the design tolerance,the relative process and the deviation are analyzed in detail, and the pertinent process optim ization is proposed,which effectively solves the problem of the center frequency offset of the filter.The implementation of the optimized process increases the center frequency deviation from ±30 MHz to ±5 MHz.

Key words: LTCC, process technology, process optimization

中图分类号: