关键词: SiC混合模块, 纳米银层, 石墨烯, 散热, 仿真

Abstract: When the high-power SiC hybrid module develops towards the requirements of miniaturization, lightweight and high-power, the maximum temperature of the module increases with the increase of power level and heat dissipation power. However, too high temperature will have a serious impact on the performance of the module, reducing its reliability and service life, so the heat dissipation of SiC hybrid modules has important research significance. The encapsulation structure of SiC hybrid module is introduced and the optimization schemes to improve its heat dissipation performance is presented in two aspects. On the one hand, the parameters of nano silver layer are adjusted for optimization. On the other hand, high thermal conductivity graphene is applied to SiC hybrid module, and the temperature distribution of chips with graphene applied in different positions is compared through simulation, thus the optimal design of heat dissipation structure of SiC hybrid module is obtained.

Key words: SiC hybrid module, nano silver layer, graphene, heat dissipation, simulation