中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2020, Vol. 20 ›› Issue (6): 060404 . doi: 10.16257/j.cnki.1681-1070.2020.0610

• 微电子制造与可靠性 • 上一篇    下一篇

具有三明治集电极结构的新型无电压回跳半超结RC-IGBT

肖紫嫣,刘超,夏云,陈万军   

  1. 电子科技大学电子薄膜与集成器件国家重点实验室,成都 610054
  • 接受日期:2020-03-09 出版日期:2020-06-17 发布日期:2020-03-23
  • 作者简介:肖紫嫣(1995—),女,四川绵阳人,硕士研究生,主要研究方向为新型Si基功率半导体器件。

A Novel Snapback-free Semi-Superjunction RC-IGBT with Sandwich Collector

XIAO Ziyan, LIU Chao, XIA Yun, CHEN Wanjun   

  1. State Key Laboratory of Electronic Thin Film and Integrated Devices of University of Electronic Science and Technology of China, Chengdu 610054, China
  • Accepted:2020-03-09 Online:2020-06-17 Published:2020-03-23

摘要: 提出了一种具有三明治集电极结构的半超结RC-IGBT(Sandwich Semi-Superjunction Reverse Conducting-Insulated Gate Bipolar Transistor, SSS-RC-IGBT),该结构通过在N+ buffer层和P+/N+集电区之间引入高阻N- layer,增大了集电极短路电阻。通过引入集电极侧的半超结,减小了漂移区的电阻,从而消除了器件的电压回跳(snapback)现象。Sentaurus 仿真结果表明 ,当本结构中N/P柱的柱深为70 μm,N/P柱的掺杂浓度为3×1015cm-3。高阻N- layer的厚度为5 μm,掺杂浓度为5×1013 cm-3时,器件不会发生snapback现象。由于所提出的器件能够完全开启且具有更高的注入效率,器件正向导通压降降低了9.7%。在正向导通电流密度为100 A/cm2的条件下进行关断时,器件的关断损耗降低了30.6%。同时,器件具有更优的Vce-Eoff折中特性和反向恢复特性。

关键词: 逆导型IGBT, 电压回跳, 半超结, 折中特性, 反向恢复

Abstract: This paper proposes a Semi-Superjunction RC-IGBT with a sandwich collector structure (Sandwich Semi-Superjunction Reverse Conducting-Insulated Gate Bipolar Transistor, SSS-RC-IGBT). The introduction of a high-resistance N- layer between the N+ buffer and the P+/N+ collector increases the short-circuit resistance of the collector. By introducing a semi-Superjunction on the collector side, the resistance of the drift region is reduced, thereby eliminating the snapback of the device. Sentaurus simulation results show that when the depth of the N/P pillar is 70 μm, and the doping concentration of the N/P pillar is 3×1015 cm-3, and the thickness of the high-resistance N-layer is 5 μm, and the doping concentration of N-layer is 5×1013 cm-3, the device completely eliminate snapback phenomenon. Since the proposed device can be fully turned on and has a higher injection efficiency, the forward voltage drop of the device is reduced by 9.7%. When the device is turned off at a current density of 100 A/cm2, the turn-off loss of the device will be reduced by 30.6%. At the same time, the device has better Vce-Eoff tradeoff characteristic and reverse recovery characteristic.

Key words: reverse conducting-insulated gate bipolar transistor, snapback, semi-superjunction, trade off, reverse recovery

中图分类号: