关键词: 硅铝合金, 电子封装材料, 物理性能, 力学性能, 金相组织

Abstract: Taking AlSi12, AlSi27, AlSi35, AlSi42, AlSi50, AlSi60, AlSi70, AlSi80 series of silicon aluminum alloy electronic packaging materials formed by hot isostatic pressing as the research object, the influence of Si content on the microstructure, thermal and physical properties and mechanical properties of the materials is analyzed and evaluated. The results show that the density, thermal conductivity, coefficient of thermal expansion (CTE) and elongation after fracture of the alloy decrease, while the stiffness and hardness increase with the increase of Si content. When the mass fraction of Si is less than or equal to 60%, the strength of the material increases with the increase of Si content, and the Si particles change from dotted or wormlike to spherical or flake, and the distribution of Si is uniform and independent. When the mass fraction of Si is more than 60%, the material strength decreases, and the Si particles gradually connect to form a skeleton matrix.

Key words: silicon aluminum alloy, electronic packaging material, physical properties, mechanical properties, metallographic structure