功率模块铜线键合技术及其可靠性研究

doi:10.16257/j.cnki.1681-1070.2017.0104

电子与封装 ›› 2017, Vol. 17 ›› Issue (9): 1 -4. doi: 10.16257/j.cnki.1681-1070.2017.0104

• 封装、组装与测试 • 下一篇

功率模块铜线键合技术及其可靠性研究

陈云，王立，吕家力，朱婷

扬州国扬电子有限公司，江苏扬州 225100

出版日期:2017-09-20 发布日期:2017-09-20
作者简介:陈云（1986—），男，江苏溧水人，硕士，研究方向为功率半导体封装工艺开发与研究。

The Cooper Wire Bonding Technology with High Reliability

CHEN Yun, WANG Li, LV Jiali, ZHU Ting

Yangzhou Guoyang Electronics Co., Ltd., Yangzhou 225100,China

Online:2017-09-20 Published:2017-09-20

摘要/Abstract

摘要： 由于铝线键合逐渐不能满足如今功率模块功率密度、工作温度不断提升的可靠性要求,因此采用铜线代替铝线,以实现更高的可靠性工作寿命。对比分析了铜线、铝线键合工艺的特点、结合强度和可靠性,证明了铜线键合工艺的可行性和高可靠性。同时分析了铜线键合工艺目前存在的问题和应对措施。

关键词: 铝线键合, 铜线键合, 可靠性

Abstract: As the Aluminum(Al) wire bonding can not meet the power density and working temperature rising reliability requirements of the power module, therefore, instead of Al wire with Cooper(Cu) wire, to achieve higher reliability life. The feasibility and high reliability of the Cu wire bonding are proved by comparing the characteristics, bond strength and reliability of bonding process of Cu wire and Al wire. At the same time, the existing problems and countermeasures of Cu wire bonding are analyzed.

Key words: Al wire bonding, Cu wire bonding, reliability

中图分类号:

TN405

陈云，王立，吕家力，朱婷. 功率模块铜线键合技术及其可靠性研究[J]. 电子与封装, 2017, 17(9): 1 -4.

CHEN Yun, WANG Li, LV Jiali, ZHU Ting. The Cooper Wire Bonding Technology with High Reliability[J]. Electronics & Packaging, 2017, 17(9): 1 -4.

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

功率模块铜线键合技术及其可靠性研究

The Cooper Wire Bonding Technology with High Reliability

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