基于ENEPIG镀层的无压纳米银膏烧结失效分析

doi:10.16257/j.cnki.1681-1070.2024.0025

电子与封装 ›› 2024, Vol. 24 ›› Issue (4): 040204 . doi: 10.16257/j.cnki.1681-1070.2024.0025

基于ENEPIG镀层的无压纳米银膏烧结失效分析

徐达,戎子龙,杨彦锋,魏少伟,马紫成

中国电子科技集团公司第十三研究所，石家庄?050061

收稿日期:2023-09-08 出版日期:2024-04-24 发布日期:2024-04-24
作者简介:徐达（1982—），男，河北石家庄人，博士，高级工程师，主要从事混合微电路工艺及先进封装研究等工作。

Failure Analysis of Pressureless Nano-Silver Paste Sintering Based on ENEPIG Coating

XU Da, RONG Zilong, YANG Yanfeng, WEI Shaowei, MA Zicheng

China Electronics Technology GroupCorporation No.13 Research Institute, Shijiazhuang 050061, China

Received:2023-09-08 Online:2024-04-24 Published:2024-04-24

摘要/Abstract

摘要： 总结了在化学镍钯浸金（ENEPIG）镀层上采用纳米银膏进行无压烧结时出现的失效模式。通过分析烧结镀层的微观形貌及力学性能，确认界面污染、烧结不充分及镀层缺陷是导致烧结失效的主要原因。应特别关注镍原子向镀层表面扩散导致的烧结失效风险。为保证烧结质量的稳定性和可靠性，需要充分重视界面的洁净度，对芯片、基板的存储条件和存储寿命实施严格管控，还需要优化烧结曲线，充分考虑溶剂释出所需时间、烧结峰值温度及其停留时间、降温速率等因素。研究结果为纳米银膏的无压烧结研究提供了新的理论参考。

关键词: 封装可靠性, 烧结失效, 纳米银膏, 化学镍钯浸金镀层

Abstract: Failure modes occurring in the pressureless sintering of electroless nickel-palladium immersion gold (ENEPIG) coatings with nano-silver paste are summarized. By analyzing the microscopic morphology and mechanical properties of the sintered coatings, it is confirmed that interfacial contamination, insufficient sintering and coating defects are the main causes of sintering failures. Particular attention should be paid to the risk of sintering failure due to diffusion of nickel atoms into the coating surface. In order to ensure the stability and reliability of the sintering quality, it is necessary to pay full attention to the interface cleanliness, and to implement strict control over the storage conditions and storage life of the chips and substrates. It is also necessary to optimize the sintering curve, fully considering factors such as the time required for solvent release, the peak temperature of the sintering and its residence time, and the rate of temperature reduction. A new theoretical reference is provided for the study of pressureless nano-silver paste sintering.

Key words: packaging reliability, sintering failure, nano-silver paste, electroless nickel-palladium immersion gold coating

中图分类号:

TN305.94

徐达,戎子龙,杨彦锋,魏少伟,马紫成. 基于ENEPIG镀层的无压纳米银膏烧结失效分析[J]. 电子与封装, 2024, 24(4): 040204 .

XU Da, RONG Zilong, YANG Yanfeng, WEI Shaowei, MA Zicheng. Failure Analysis of Pressureless Nano-Silver Paste Sintering Based on ENEPIG Coating[J]. Electronics & Packaging, 2024, 24(4): 040204 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

基于ENEPIG镀层的无压纳米银膏烧结失效分析

Failure Analysis of Pressureless Nano-Silver Paste Sintering Based on ENEPIG Coating

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