关键词: 铜片夹扣键合, 功率器件, 封装, 散热, 系统级封装, 可靠性

Abstract: Copper Clip technology is a new technology to replace the traditional multi-wire bonding process and thick wire bonding, it has certain performance advantages then traditional wire bonding product, and depend on the continuous extension of technology development, Copper Clip product structure has become diverse. This paper researched the Copper Clip product structure design and process design development direction, analyzes the performance advantages of Copper Clip products ,at the same time, analyzes the characteristics of different stages of product structure and development trend of Copper Clip, and depend on the package product development requirement, derived the future development direction of Copper Clip product structure, the bottleneck problem in the future development , base on the study of process ,material ,structure ,gives a solution of all the problems.

Key words: copper clip bond, power device, assembly, thermal dissipation, SIP, reliability