关键词: 高温共烧陶瓷, 气密性封装, 平行缝焊

Abstract: As an important form of hermetic packaging, parallel seam sealing process is widely used due to its wide range of application and high reliability. In the hermetic packaging application of high temperature co-fired ceramics (HTCC) products, there are many factors that may cause defective seal of product, or circuit failure. In this paper, the effects of parallel seam sealing process on hermetic packaging effect of HTCC products are studied from four aspects, the cleanliness of product cover and base, pre-welding process control, package fixture fabrication and package parameter settings. The conclusions are as follows: In order to reduce the thermal shock of ceramic shell during parallel seam sealing, the pulse width should be short in the pulse period, and the welding energy should be as small as possible. In the meanwhile, the quality of weld bead affected by the non-packaging parameters in parallel seam sealing process can also affect hermetic packaging of HTCC products.

Key words: HTCC, hermetic packaging, parallel seam sealing