关键词: 封装, 硅转接板, 焊球, 基板, 热疲劳寿命

Abstract: The silicon interposer packaging architecture is widely applied in 3D-TSV, and mechanical reliability is one of the critical problems for system integration. A finite element analysis method was used to study the stress characteristic，strain characteristic and thermal fatigue life of the packaging architecture with TSV interposer during the packaging process and the service process. The influence of substrate material on the mechanical reliability of the packaging architecture was studied by FEM, and an optimization method of the substrate materials was proposed according to the FEM results. The proposed analysis method can be used to optimize the packaging architecture, verify the mechanical reliability, improve the design efficiency, and shorten the development cycle.

Key words: packaging, silicon interposer, solder ball, substrate , thermal fatigue life