中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2019, Vol. 19 ›› Issue (3): 041 -43. doi: 10.16257/j.cnki.1681-1070.2019.0034

• 微电子制造与可靠性 • 上一篇    下一篇

FEP含量对PTFE基高频PCB覆铜板性能的影响

张 勇1,陈 强1,冯澍畅2、张军然1、徐永兵1   

  1. 1. 南京大学,南京 210046;2. 英国约克大学,英国
  • 出版日期:2019-03-20 发布日期:2020-01-16
  • 作者简介:张 勇(1993—),男,江苏徐州人,硕士研究生在读,现就读于南京大学电子科学与工程学院,主要研究方向为高频微波覆铜板。

The Effect to Characteristics of Copper Clad Laminates Based on Polytetrafluoroethylene with Different Content of Fluorinated Ethylene Propylene

ZHANG Yong1, CHEN Qiang1, FENG Shuchang2, ZHANG Junran1, XU Yongbing1   

  1. 1. Nanjing University, Nanjing 210046, China; 2. University of York, United Kingdom
  • Online:2019-03-20 Published:2020-01-16

摘要: 主要介绍制备微波高频PCB覆铜板时,PTFE树脂中FEP乳液体积浓度对浸渍玻纤布树脂含量的影响,以及对制作的pp(Pre-pregnant)介电常数(Dk)和介电损耗(Df)的影响。试验显示,随着树脂中FEP乳液含量的增加,浸渍玻纤布树脂百分比降低,而Dk和Df值升高,用pp所制作PCB覆铜板的铜箔剥离强度随着FEP乳液含量的升高而增大。

关键词: FEP;浓度;介电常数;介电损耗;剥离强度

Abstract: This article revealed that the effect on glue content, Dk and Df depending volume concentration of FEP emulsion in PTFE resin on of impregnated fiberglass cloth, when making microwave high frequency copper clad laminate. With the increase of the concentration of FEP emulsion in the resin, resin content in impregnated fiberglass cloth reduced while Dk and Df increased. In addition, peeling strength of copper foil of copper clad laminate made of impregnated fiberglass cloth increased with FEP content increase.

Key words: FEP; concentration; dielectric constant; loss tangent; peel strength

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