中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (1): 010101 . doi: 10.16257/j.cnki.1681-1070.2020.0101

• 封装、组装与测试 •    下一篇

微波复合介质板的介电性能验证研究

赵丹,邹嘉佳,方南军   

  1. 中国电子科技集团公司第三十八研究所,合肥 230031
  • 收稿日期:2019-08-19 出版日期:2020-01-15 发布日期:2020-01-15
  • 作者简介:赵 丹(1983—),男,浙江东阳人,硕士,高级工程师,主要从事雷达工艺总体技术研究。

Research on Verification of Dielectric Properties for New Microwave Laminates

ZHAO Dan, ZOU Jiajia, FANG Nanjun   

  1. China Electronics Technology Group Corporation No.38 Research Institute, Hefei 230031, China
  • Received:2019-08-19 Online:2020-01-15 Published:2020-01-15

摘要: 以国外某公司的微波复合介质基板测试数据为参考,采用50 Ω阻抗匹配电路测试了介电常数为2.94的某国产微波复合介质板在10 GHz下的驻波、插入损耗。测试结果表明,国产微波复合介质板的介电性能满足电路使用要求。高低温环境下的性能测试结果表明国内板材的一致性略逊于国外产品,仍需对制备工艺的稳定性、一致性进行改善优化。

关键词: 微波复合介质板, 介电性能验证, 基本电路, 一致性

Abstract: Using the test data of a foreign company’s microwave composite dielectric board as a reference, the standing wave and insertion loss of a domestic microwave composite dielectric board with dielectric constant of 2.94 at 10 GHz are measured by means of a 50 Ω impedance-matching circuit. The test results show that the dielectric properties of the domestic microwave composite dielectric board meet the circuit requirements. Through the performance test in high/low temperature environments, the results show that the consistency of domestic plate is slightly lower than those of foreign products, and the stability and consistency of the preparation process still need to be improved and optimized.

Key words: microwave laminates, dielectric properties verification, basic circuits, consistency

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