关键词: 梅花形, 表面安装元件, 点胶方式, 粘接工艺, 高可靠, 剪切强度, 工艺一致性

Abstract: In highly reliable hybrid circuits and microsystem devices, the improvement and optimization of bonding process for surface mount components has been the focus of attention. Plum blossom shape automatic dispensing process is proposed. The test data shows that by improving the dispensing method and optimizing the adhesive morphology, the bonding strength of surface mounted components is increased by more than 50%, and the consistency of the bonding process is effectively improved.This method solves many problems such as the bonding position deviation, the insufficient end wrapping rateof surface mount components. It can be extended to the bonding process of internal surfacemounted components of hybrid integrated circuits, MCM, SiP and other devices, and has reference value for the packaging and improvement of high-reliability devices.

Key words: plumblossomshape, surfacemountcomponents, dispensingmode, bondingprocess, highreliability, shearstrength, processconsistency