关键词: 热风枪, 印制板, 电子元件, 快速拆焊

Abstract: Aiming at the characteristics of PCB, such as large area, many solder joints and dense contacts, the paper puts forward the technical application method of hot air gun de-soldering electronic components from the aspects of comparison of de-soldering methods, reliability and production practice. Through the feasibility analysis of the electrical properties, thermal stress and other aspects of the hot air gun de-soldering PCB, and test and verifies the temperature, air volume, heating time and other aspects for many times, and obtains the safety method of hot air gun de-soldering speed and high qualification rate, but also has important guiding significance for the de-soldering of components in the same industry.

Key words: hot air gun, PCB, electronic component, rapid de-soldering