中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (3): 030201 . doi: 10.16257/j.cnki.1681-1070.2020.0301

• 封装、组装与测试 •    下一篇

陶瓷封装恒定加速度试验的分析与改进

丁荣峥1,蒋玉齐2,吕栋1,仝良玉2   

  1. 1.中科芯集成电路有限公司,江苏 无锡 214072;2.无锡中微高科电子有限公司,江苏 无锡 214035
  • 发布日期:2020-03-26
  • 作者简介:丁荣峥(1967—),男,江苏兴 化人,1991年毕业于长春光学精密机械学院,研究员级高级工程师,主要从事集成电路封装设计、封装工艺技术开发、封装失效分析及可靠性、标准化等工作。

Simulation Analysis and Verification of Constant Acceleration Test for Ceramic Package

DING Rongzheng1,JIANG Yuqi2,LYU Dong1,TONG Liangyu2   

  1. 1.China Key System &Integrated Circuit Co.,Ltd.,WuXi 214072,China;2. Wuxi Zhongwei High-tech Electronics Co.,Ltd.,WuXi 214035,China
  • Published:2020-03-26

摘要: 多芯片、模块及其系统级陶瓷封装结构复杂,封装腔内各种元器件不均衡布置,如何设计合适的恒定加速度试验固定夹具,保证筛选过程中既能发现结构缺陷又不损伤封装体,已经成为封装结构设计中的重要考虑因素,这也是机械可靠性验证不可或缺的内容。针对恒定加速度试验中几种固定方式存在的问题,通过仿真分析和试验改进验证,提出了确定系统级陶瓷封装器件恒定加速度试验的固定方法,有效消除了试验不当导致的误判,大大提高了试验的可信度。

关键词: 模块, 微系统, 陶瓷封装, 恒定加速度试验, 结构强度

Abstract: MCP, MCM and SiP have complex strcture and have unbalanced arrangement of components inside the ceramic package. These lead to a necessary test to design a package structure and to verify mechanical reliability. This test needs to find how to design a fixed package for constant acceleration and to find defects and improvements early without damaging the package. Based on the difference and existing problems of fixed modes in constant acceleration, simulation analysis and test improvement can propose a fixed method for determining the constant acceleration test of ceramic SiP, which effectively eliminates the misjudgment caused by improper test and greatly improves the reliability of the test.

Key words: MCM, SiP, ceramic package, constant acceleration, structural strength

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