关键词: 底部填充胶, 选型, 仿真, 理论分析

Abstract: This article starting from the analysis of the necessity of underfilling flip-chip devices, the selection process, basic selection methods and key parameters matching of underfilling adhesive were analyzed, and four underfilling materials were selected. Through theoretical calculation of key parameters of four materials and simulation calculation of constant acceleration and thermodynamic coupling, one material is selected as the sample material. At the same time, the verification contents of underfill materials are combed, and the applicable scope and boundary conditions of the materials are explored through test certificates. The verification method for the selection of underfill adhesive has certain guiding significance for the selection of other polymeric materials for military hybrid integrated circuits.

Key words: underfill, type selection, simulation, theoretical analysis