中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2022, Vol. 22 ›› Issue (9): 090205 . doi: 10.16257/j.cnki.1681-1070.2022.0910

• 封装、组装与测试 • 上一篇    下一篇

硅铝丝引线键合参数化建模仿真

蒋玉齐1;刘书利2;夏晨辉2;王毅恒1;陈桥红1;周超杰2   

  1. 1.无锡中微高科电子有限公司,江苏 无锡  214035;2.中国电子科技集团公司第五十八研究所,江苏 无锡  214072
  • 收稿日期:2022-01-20 出版日期:2022-09-22 发布日期:2022-04-13
  • 作者简介:蒋玉齐(1974—),男,广西南宁人,博士,2004年毕业于中科院上海微系统与信息技术研究所,研究方向为电子封装及其可靠性。

Parametric Modelling forAlSiWire Bonding

JIANG Yuqi1, LIU Shuli2, XIA Chenhui2, WANG Yiheng1, CHEN Qiaohong1, ZHOU Chaojie2   

  1. 1. Wuxi ZhongweiHigh-tech Electronics Co., Ltd., Wuxi 214035, China; 2.China Electronics Technology GroupCorporation No.58 Research Institute, Wuxi 214072, China
  • Received:2022-01-20 Online:2022-09-22 Published:2022-04-13

摘要: 拉力测试是检验引线键合强度的常用手段。为了更好地研究硅铝丝在拉力测试过程中的受力情况,结合力学理论模型、三维有限元仿真模型和实验数据对比,分析了相关键合参数和初始塑性变形的影响。在拉钩上升过程中,拉力先变大、后变小,伴随着引线的颈缩。在水平方向上,弧线的最高点距离第一焊点越近,拉脱力越大。在弧线水平跨距不变的情况下,弧高变大时,拉脱力也变大。与实验数据相对比,仿真模型的预测准确性达到了95%,为硅铝丝引线键合工艺提供了快速和准确的评估方法。

关键词: 硅铝丝键合, 拉脱力, 理论分析, 参数化建模, DOE实验

Abstract: Wire bonding strength is usually examined by wire pull test. To study the stress and strain during pull test for AlSi wire bonding, theoretical analysis, finite element analysis, and experiment verification are conducted. Bonding parameters effect and the initial plastic strain effect are investigated. The pulling force increases with the rising of the test hook, then decreases with the wire necking. The closer to the first bond horizontally, the greater the maximum pull force. With the same horizontal wire span, the pull force increases with the increase of loop height. The finite element analysis gives an exactness of 95% compared to the experiment results. This is a quick and exact evaluation method for the AlSi wire bonding.

Key words: silicon-aluminum (AlSi)wire bonding, pull force, theoretical analysis, parametric modeling, DOE

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