关键词: 绿色电子封装材料, 导电胶, 有机可焊保护膜, 改性铜粉, 抗氧化性

Abstract: In response to the problems of low price, high migration resistance, and high cost performance of copper-based conductive adhesives that are easily oxidized, easy to settle, and short storage period, a multi-functional modifier was designed, and OSP process (Organic Solderability Preservatives) was used to modify the copper powder which are used as a conductive filler to develop a modified copper/epoxy conductive adhesive with excellent comprehensive performance. The experimental results show that OSP modification can form an effective protective film on the surface of copper powder, thereby isolating hot oxygen and water vapor, significantly enhancing the oxidation resistance of conductive filler, and improving the comprehensive performance of copper/epoxy conductive adhesive. This study provides new ideas for the development of cost-effective copper-based conductive adhesives and has important practical value.

Key words: green electronic packagingmaterials, electrically conductive adhesive, organic solderabilitypreservatives, modified copper powder, oxidation resistance