瞬态液相烧结材料和工艺研究进展

doi:10.16257/j.cnki.1681-1070.2021.1105

摘要/Abstract

摘要： 随着高温半导体SiC、GaN功率器件不断增加和其寿命要求的提高，器件需承受500℃以上的工作温度，同时电子元器件在封装技术和组装技术上的多层级工艺温度控制需求，都对互连材料提出了更严苛的要求。传统高温互连材料（主要包含高铅焊料和金基焊料）因钎焊温度高和固相线温度低已不能满足高温应力环境要求。介绍瞬态液相烧结（TLPS）的原理，从TLPS不同体系的制备、烧结工艺和性能、可靠性研究进行综述，最后提出TLPS研究过程中存在的问题，并对TLPS技术发展做出展望。

关键词: 瞬态液相烧结, 烧结膏, 焊料, 金属间化合物

Abstract: With the continuous increase of high temperature semiconductor SiC and GaN power devices and the improvement of life requirements, the devices need to withstand the working temperature above 500 ℃, and the requirements of multi-layer process temperature control in packaging technology and assembly technology of electronic components put forward more stringent requirements for interconnection materials. The traditional high temperature interconnection materials (mainly including high lead solder and gold-based solder) can not meet the requirements of high temperature stress environment because of high brazing temperature and low solidus temperature. The principle of transient liquid phase sintering (TLPS) is introduced. The preparation, sintering process, performance and reliability of different systems of TLPS are reviewed. Finally, the existing problems in the research process of TLPS are put forward, and the development of TLPS technology is prospected.

Key words: transientliquidphasesintering, sinterpaste, solder, IMC

中图分类号:

吴文辉. 瞬态液相烧结材料和工艺研究进展[J]. 电子与封装, 2021, 21(11): 110204 .

WU Wenhui. Review of Research Progress on Materials and Processesof Transient Liquid Phase Sintering (TLPS)[J]. Electronics & Packaging, 2021, 21(11): 110204 .

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