中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (11): 110403 . doi: 10.16257/j.cnki.1681-1070.2021.1114

• 微电子制造与可靠性 • 上一篇    下一篇

3300 V混合SiC IGBT模块研制与性能分析*

杨晓菲;于凯;董妮;荆海燕;刘爽   

  1. 中车永济电机有限公司,西安 710016
  • 收稿日期:2021-03-30 出版日期:2021-11-24 发布日期:2021-06-24
  • 作者简介:杨晓菲(1987—),女,陕西西安人,硕士,工程师,现从事IGBT器件结构设计、仿真、封装工艺研究。

Developmentand Performance Analysis of 3300 V Hybrid SiC IGBT Module

YANG Xiaofei, YU Kai, DONG Ni, JING Haiyan, LIU Shuang   

  1. CRRC Yongji Electric Co., Ltd., Xi’an 710016, China
  • Received:2021-03-30 Online:2021-11-24 Published:2021-06-24

摘要: 传统IGBT模块内部集成有PiN结构的Si基二极管作为续流二极管,该二极管开关损耗大,并且在关断时存在电流、电压过冲现象,使得IGBT模块整体功耗增大,可靠性降低。通过SiC JBS代替模块内原有的PiN结构Si基二极管,研制了3300 V/1500 A等级的Si IGBT/SiC JBS混合模块。介绍混合模块的设计方法、制造工艺及测试结果,并对比传统Si基IGBT模块与Si IGBT/SiC JBS混合模块电学参数的差异。通过相同工况条件下的功耗计算,对比两者功耗之间的差别。研究表明Si IGBT/SiC JBS模块中二极管的开关时间减小91.9%、开关能量减小98.3%,二极管功耗相对减少了62.1%,使得混合模块整体功耗降低,消除电压、电流过冲,提高模块可靠性。

关键词: 碳化硅, 结势垒控制肖特基二极管, 绝缘栅双极型晶体管, 混合模块

Abstract: The traditional IGBT module is integrated with PIN-structured Si-based diodes as continuing-current diodes. The switching loss of the diodes is large, and the current and voltage overcharge phenomenon exists when the diode is turned off, which increases the overall power consumption and reduces the reliability of the IGBT module. A 3300 V/1500 A SiC IGBT/SiC JBS hybrid module is developed by using SiC JBS to replace the original Pin-structured Si-based diode in the module.The design method, manufacturing process and test results of the hybrid module are introduced, and the differences of electrical parameters between the traditional Si-based IGBT module and the SiC /SiC JBS hybrid module are compared. Through the calculation of power consumption under the same working condition, the difference of power consumption between the two is compared. The research shows that the switching time and switching energy of the diodes in the Si IGBT/SiC JBS modules are reduced by 91.9%, 98.3% and 62.1% respectively, which reduces the overall power consumption of the hybrid module, eliminates the overcharge of voltage and current, and improves the reliability of the module.

Key words: SiC, JBS, IGBT, hybridmodule

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