关键词: 热阻, 参数化仿真, 导热率

Abstract: The choice of packaging materials and technology directly affects the junction-ambient thermal resistance of the chip. This paper compares the thermal resistance test and simulation results of the CQFP-U integrated circuit chip to ensure the accuracy of the simulation. The method of parametric simulation research is used to analyze the influence of different materials of thermal conductive glue and heat sink and different PCB board sizes on the thermal resistances of the chip junction environment. The result show that the heat dissipation performance of the PCB board has a greater impact on the thermal resistance of the CQFP-U chip, and the increase in the thermal conductivity of the heat sink and the thermal conductive adhesive material has a lower impact on the thermal resistance.

Key words: thermalresistance, parameterizationsimulation, heatconductivity