中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (5): 050205 . doi: 10.16257/j.cnki.1681-1070.2021.0508

• 封装、组装与测试 • 上一篇    下一篇

LDO类IC多工位测试方法探索

王金萍   

  1. 中国电子科技集团公司第58研究所,江苏 无锡 214072
  • 收稿日期:2020-10-16 出版日期:2021-05-18 发布日期:2020-12-25
  • 作者简介:王金萍(1989—),女,河北沧州人,工程师,2016年毕业于江南大学控制工程专业,现在中国电科第58所从事集成电路测试技术研究工作,主要研究方向为模拟和数字电路的测试技术。

Exploration of Multi-site Test Method for LDOIC

WANG Jinping   

  1. ChinaElectronic Technology Group Corporation No.58 Research Institute, Wuxi214072, China
  • Received:2020-10-16 Online:2021-05-18 Published:2020-12-25

摘要: 随着科技的发展,芯片的功能、可靠性和稳定性变得越来越重要,从而使得芯片测试越来越受到重视。低压差线性稳压器(LDO)因其成本低廉,应用广泛,市场需求量巨大,该类芯片的测试在硬件测试中的地位不可或缺。而LDO类芯片根据其衬底不同,测试方法也不尽相同。研究不同衬底下LDO类芯片多工位测试方法,有效提高了测试效率,降低测试成本。

关键词: 芯片测试, 低压差线性稳压器, 多工位测试

Abstract: With the development of science and technology, the function, reliability and stability of hardware chip become more and more important, which makes chip test more and more important. Due to its low cost, wide application and huge market demand, low dropout regulator is indispensable in hardware testing. However, the testing methods of LDO chips are different according to their wafer substrates. This paper will study the multi-site test method of LDO chip under different substrates, so as to effectively improve the test efficiency and reduce the test cost.

Key words: chiptest, lowdropoutregulator, multi-sitetest

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