关键词: 薄型塑封, 钝化层损伤, 合模压力, 失效分析

Abstract: Aiming at the open and short circuit problem in the trial production of a thin plastic packaging product, the defect mode of passivation layer of the chip damaged by inorganic filler particles in the plastic packaging material is confirmed by means of surface lapping, cross-section cutting and energy spectrum analysis. The passivation layer damage is analyzed and verified from the perspectives of the use control of plastic packaging materials, and the improvement of plastic packaging process parameters and the selection of plastic packaging materials. The results show that the application process of mold closing pressure is the key factor affecting the damage of chip passivation layer. The defect can be effectively improved by keeping a steady 215 kN clamping pressure setting, which provides reference suggestions for the setting of molding parameters and material selection of thin plastic packaging.

Key words: thin plastic packaging, passivation layer damage, clamping force, failure analysis