中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2022, Vol. 22 ›› Issue (8): 080402 . doi: 10.16257/j.cnki.1681-1070.2022.0813

• 材料、器件与工艺 • 上一篇    下一篇

沟槽型VDMOS的重离子辐射失效研究

廖聪湘;徐海铭   

  1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214072
  • 收稿日期:2022-03-08 出版日期:2022-08-26 发布日期:2022-04-15
  • 作者简介:廖聪湘(1981—),男,湖南郴州人,本科,工程师,主要研究方向为微电子技术、半导体设备应用。

Research on Heavy-Ion Radiation Failure of Trench VDMOS

LIAO Congxiang, XU Haiming   

  1. China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214072, China
  • Received:2022-03-08 Online:2022-08-26 Published:2022-04-15

摘要: 空间辐射环境中含有各种高能带电粒子,高能带电粒子与电子器件相互作用可能引发单粒子效应(SEE),单粒子效应中单粒子烧毁(SEB)和单粒子栅穿(SEGR)是两种最主要的单粒子事件。对重离子环境下的器件退化和失效进行了研究,分析了重离子环境下的失效机理,提出了重离子条件下的器件改善结构,同时完成了仿真和重离子实验验证,提升了MOSFET抗重离子能力。

关键词: 功率晶体管, 沟槽型VDMOS, MOSFET, 单粒子烧毁, 单粒子栅穿

Abstract: Space radiation environment contains a variety of high-energy charged particles, and the interaction of high-energy charged particles with electronic devices may lead to single event effect (SEEs). Single event burnout (SEB) and single event gate rupture (SEGR) are the two most prominent SEEs. The device degradation and failure in heavy ion environment are studied, and the failure mechanism in heavy ion environment is analyzed. The improved structure of device in heavy ion environment is proposed, and the simulations and heavy ion experiments are completed to improve the anti-heavy ion ability of MOSFET.

Key words: power transistors, trench VDMOS, MOSFET, single event burnout, single event gate rupture

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