电子组装用Sn-Sb系无铅钎料研究进展*

doi:10.16257/j.cnki.1681-1070.2023.0004

摘要/Abstract

摘要： Sn-Sb系钎料的熔点比Sn-38Pb钎料的熔点高约60℃，并且Sn-Sb系钎料在高温下仍然具有稳定的微观组织及良好的机械性能和抗蠕变性能，所以Sn-Sb系钎料具有应用在高温环境中的能力。许多研究者通过合金化或者添加纳米颗粒的方法来进一步改善Sn-Sb系钎料的综合性能，目前对Sn-Sb系钎料的界面反应和熔化特性的研究相对较少。叙述了国内外关于Sn-Sb系钎料的研究进展，阐述了合金化和颗粒强化对Sn-Sb系钎料的显微组织、界面反应、力学性能、润湿性、熔化特性和抗蠕变性能的影响，探究了钎料在改性方面的成果。总结了目前对Sn-Sb系钎料研究的不足之处和发展的趋势，以期为日后的研究提供相关的理论指导。

关键词: Sn-Sb, 无铅钎料, 显微组织, 抗蠕变性能

Abstract: Melting points of Sn-Sb solders are about 60 ℃ higher than those of Sn-38Pb solders, and Sn-Sb solders still have stable microstructures and good mechanical properties and creep resistances at high temperatures, so Sn-Sb solders have the ability to be applied in high-temperature environments. Many researchers have further improved the comprehensive performance of Sn-Sb solders by alloying or adding nanoparticles. There are few relatively studies on interfacial reactions and melting properties of Sn-Sb solders. The research progress of Sn-Sb solders at home and abroad is provided, the effects of alloying and particle strengthening on microstructures, interfacial reactions, mechanical properties, wettability, melting characteristics and creep resistances of Sn-Sb solders are described, and the results of solders in modification are explored. Shortcomings and development trends of the research on Sn-Sb solders are summarized in order to provide relevant theoretical guidance for the future research.

Key words: Sn-Sb, lead-free solder, microstructure, creep resistance

中图分类号:

王曦;张亮;李木兰;姜楠. 电子组装用Sn-Sb系无铅钎料研究进展^*[J]. 电子与封装, 2023, 23(2): 020201 .

WANG Xi, ZHANG Liang, LI Mulan, JIANG Nan. Research Progress of Sn-Sb Lead-FreeSolders in Electronic Assemble[J]. Electronics & Packaging, 2023, 23(2): 020201 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

电子组装用Sn-Sb系无铅钎料研究进展^*

Research Progress of Sn-Sb Lead-FreeSolders in Electronic Assemble

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