关键词: 导电胶, 接触电阻, 电极材料, 固化参数, 导电胶量

Abstract: Microwave circuits contain a large number of chip capacitors and resistors,most of which are assembled by conductive adhesivebonding. The contact resistances of conductive adhesive bonded chip devices are experimentally studied，and the influence mechanism of contact resistance on the performance microwave circuits is analyzed.The experimental research iscarried out from the aspects of electrode materials, curing parameters and the amount of conductive adhesive.The results show that the electrode material of the chip device is the main reason affecting the increase of contact resistance,the curing parameters have a certain influence on the increase of contact resistance.The longer the curing time is,the more stable the contact resistance is,and the amount of conductive adhesive used for bonding has no effect on the change of contact resistance.The contact resistance can be reduced by using Au/Ag electrode material,appropriately increasing the curing time and welding gold between the device electrode end and the substrate pad.

Key words: conductive adhesive, contact resistance, electrode material, curing parameters, amount of conductive adhesive