关键词: 银胶, 热导率, 体积电阻率, 热阻

Abstract: With the development of miniaturization and lightweight of electronic devices, electronic packaging is also tending to be smaller in size, more precise and complex in structures. Traditional soldered interconnects are becoming increasingly difficult to solve the heat dissipation problemscaused by the precision packaging structures. As a new type of interconnect material with high performance, low pollution and easy operation, silver glue is gradually replacingbrazing and playing an increasingly important role in high-end chip interconnection and other fields. In response tothe difficulty that the thermal conductivity and resistivity of silver glue in the market can hardly meet the demand,the epoxy resin, flake silver powder, modified alicyclic amine curing agent, coupling agent, diluent and catalyst are used to improve the epoxy resin-based silver glue, and the effects of silver powder morphology, ratio and preparation process on the thermal conductivity and resistivity of silver glue are systematically studied, and high thermal conductivity [7.21 W·(m·K)^-1] and low volume resistivity (4.46×10^-5Ω·cm) of epoxy silver glue.Through the bonding thermal resistance test between different substrates, it is verified that the obtained epoxy silver adhesive has lower thermal resistance between substrates, which is expected to be applied to the interconnection of high-end chip packaging.

Key words: silver glue, thermal conductivity, volume resistivity, thermal resistance