多场耦合下RF组件的焊点信号完整性

doi:10.16257/j.cnki.1681-1070.2024.0024

摘要/Abstract

摘要： 随着集成电路和5G技术的迅猛发展，射频（RF）组件作为关键设备被广泛使用。RF组件需要在复杂多变的工作环境下服役，而焊点作为RF组件封装中相对脆弱的部分，其稳定性和可靠性尤为重要。介绍了焊点在多场耦合下的性能表现。RF组件焊点需要有效传输高频信号，从电气性能和信号完整性两方面对其进行概述，对多场耦合下的焊点信号完整性进行了总结，探讨了在高频条件下对焊点的机械性能和信号完整性进行综合研究和优化的必要性。

关键词: 焊点, 射频组件封装, 多场耦合, 信号完整性, 机械性能

Abstract: With the rapid development of integrated circuits and 5G technology, radio frequency (RF) components are widely used as key devices. RF components need to serve in complex and changing operating environments, and the solder joints, as a relatively fragile part of the RF component package, are particularly important for their stability and reliability. The performance of solder joints under multi-field coupling is presented. RF component solder joints are required to effectively transmit high-frequency signals, an overview is given from the aspects of electrical performance and signal integrity, and the signal integrity of solder joints under multi-field coupling is summarized, and the necessity of a comprehensive study and optimization of the mechanical properties and signal integrity of solder joints under high-frequency conditions are explored.

Key words: solder joint, RF component package, multi-field coupling, signal integrity, mechanical properties

中图分类号:

TN305.94

田文超,孔凯正,周理明,肖宝童. 多场耦合下RF组件的焊点信号完整性[J]. 电子与封装, 2024, 24(3): 030206 .

TIAN Wenchao, KONG Kaizheng, ZHOU Liming, XIAO Baotong. Signal Integrity of Solder Joint of RF Components Under Multi-Field Coupling[J]. Electronics & Packaging, 2024, 24(3): 030206 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊