Sn95Sb5焊料与ENIG/ENEPIG镀层焊点界面可靠性研究

doi:10.16257/j.cnki.1681-1070.2024.0023

电子与封装 ›› 2024, Vol. 24 ›› Issue (3): 030205 . doi: 10.16257/j.cnki.1681-1070.2024.0023

Sn95Sb5焊料与ENIG/ENEPIG镀层焊点界面可靠性研究

徐达¹,魏少伟¹,申飞²,梁志敏²,马紫成¹

1. 中国电子科技集团公司第十三研究所，石家庄? 050061；2. 河北科技大学材料科学与工程学院，石家庄 050018

收稿日期:2023-08-24 出版日期:2024-03-27 发布日期:2024-03-27
作者简介:徐达（1982—），男，河北石家庄人，博士，高级工程师，主要从事混合微电路工艺及先进封装研究等工作。

Interfacial Reliability Study of Sn95Sb5 Solder and ENIG/ENEPIG Coating Joints

XU Da¹, WEI Shaowei¹, SHEN Fei², LIANG Zhimin², MA Zicheng¹

1.?? China Electronics Technology GroupCorporation No.13 Research Institute,Shijiazhuang 050061, China; 2. School of Material Science and Engineering, Hebei University of Science and Technology, Shijiazhuang 050018, China

Received:2023-08-24 Online:2024-03-27 Published:2024-03-27

摘要/Abstract

摘要： 研究了Sn95Sb5焊料在化学镍金（ENIG）镀层、化学镍钯浸金（ENEPIG）镀层表面形成的焊点界面微观组织形貌与剪切强度。使用Sn95Sb5焊料在FR4印制板上焊接0805片式电容，焊点在高温时效测试和温度循环过程中均表现出较高的剪切强度，焊点界面连续且完整，剪切强度下降的最大幅度不超过19.2%。Sn95Sb5焊料在ENIG镀层表面形成的焊点（Sn95Sb5/ENIG焊点）强度更高。Sn95Sb5焊料在ENEPIG镀层表面形成的焊点（Sn95Sb5/ENEPIG焊点）界面反应更为复杂，在焊点界面附近可观察到条块状的（Pd，Ni，Au）Sn₄。Sn95Sb5/ENEPIG焊点界面的金属间化合物层平均厚度约为Sn95Sb5/ENIG焊点界面的2倍。

关键词: Sn95Sb5焊料, 化学镍金镀层, 化学镍钯浸金镀层, 回流焊

Abstract: The microstructural morphology and shear strength of the solder joint interface formed by Sn95Sb5 solder on the surfaces of electroless nickel-gold (ENIG) coatings and electroless nickel-palladium immersion gold (ENEPIG) coatings are investigated. Using Sn95Sb5 solder to solder 0805 chip capacitors on FR4 printed circuit boards, the solder joints show high shear strength in both high temperature aging tests and temperature cycling, the solder joint interface is continuous and intact, and the maximum decrease in shear strength degradation does not exceed 19.2%. The solder joints formed by Sn95Sb5 solder on the surface of the ENIG coating (Sn95Sb5/ENIG solder joints) have higher strength. The interfacial reaction of Sn95Sb5 solder on the surface of ENEPIG coating (Sn95Sb5/ENEPIG solder joints) is more complex, and strip-like (Pd, Ni, Au) Sn₄ can be observed near the solder interface. The average thickness of the intermetallic compound layer at the Sn95Sb5/ENEPIG solder joint interface is about twice that at the Sn95Sb5/ENIG solder joint interface.

Key words: Sn95Sb5 solder, electroless nickel-gold coating, electroless nickel-palladium immersion gold coating, reflow soldering

中图分类号:

TN305.94

徐达,魏少伟,申飞,梁志敏,马紫成. Sn95Sb5焊料与ENIG/ENEPIG镀层焊点界面可靠性研究[J]. 电子与封装, 2024, 24(3): 030205 .

XU Da, WEI Shaowei, SHEN Fei, LIANG Zhimin, MA Zicheng. Interfacial Reliability Study of Sn95Sb5 Solder and ENIG/ENEPIG Coating Joints[J]. Electronics & Packaging, 2024, 24(3): 030205 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

Sn95Sb5焊料与ENIG/ENEPIG镀层焊点界面可靠性研究

Interfacial Reliability Study of Sn95Sb5 Solder and ENIG/ENEPIG Coating Joints

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