关键词: BGA封装, Anand模型, 焊点, 热冲击, 疲劳寿命

Abstract: BGA package plays an important role in the interconnection and information transmission of electronic components. It is particularly important to study the reliability of package components and the stability of internal solder joints under extreme conditions such as high temperature, high humidity and high pressure. Based on the Anand model, the plastic deformation and stress distribution of the package component under thermal shock are analyzed. At the same time, the maximum stress and the main failure position of the solder joints at different spatial positions are compared. The Darveaux model is used to calculate the crack initiation, crack propagation rate and fatigue life of the most dangerous unit of the solder joints. The results show that under the thermal shock limit load, the temperature of the package component is symmetrically distributed, and the difference between the surface temperature and the internal temperature is large, which is about 15 °C. The maximum deformation is 0.038 mm, and the maximum deformation position is the outer coating. The maximum stress is 222.18 MPa, and the stress value of the rest of the interior is about 20 MPa. For the internal solder joints, the maximum stress is 19.02 MPa (250 s), and the maximum stress position is at the edge below the solder ball. It is estimated that the fatigue life is 6.29 days.

Key words: BGA package, Anand model, solder joint, thermal shock, fatigue life